| 摘要 |
A filer package comprises a substrate; a body comprising a plurality of resonators, which are coupled to the substrate, respectively, and a metal circuit pattern, which is formed on the substrate through patterning, each of the plurality of resonators being made of a dielectric material, and the body having a through-hole formed in one direction; and a conductive film coupled to one of opposite end surfaces of the body, which is coupled to the substrate, and to a wall surface of the through-hole. |
