SEMICONDUCTOR DEVICE EVALUATION JIG, SEMICONDUCTOR DEVICE EVALUATION APPARATUS, AND SEMICONDUCTOR DEVICE EVALUATION METHOD

摘要

A board-like conductive base body (21) of a semiconductor device evaluation jig (20) has: placing regions (R1, R2, R3) in which a semiconductor device (30) is placed, said placing regions being parts of a front surface (21a); and through holes (21e) penetrating the base body (21) in the placing regions (R1, R2, R3). A temperature detection element (22) is attached to the base body (21). An electrode pad (23) is electrically connected to the temperature detection element (22), and is formed on the front surface (21a) side.