发明名称 |
SEMICONDUCTOR CHIP PACKAGE ASSEMBLY WITH IMPROVED HEAT DISSIPATION PERFORMANCE |
摘要 |
A semiconductor chip package assembly includes a package substrate having a chip mounting surface; a plurality of solder pads disposed on the chip mounting surface; a first dummy pad and a second dummy pad spaced apart from the first dummy pad disposed on the chip mounting surface; a solder mask on the chip mounting surface and partially covering the solder pads, the first dummy pad, and the second dummy pad; a chip package mounted on the chip mounting surface and electrically connected to the package substrate through a plurality of solder balls on respective said solder pads; a discrete device having a first terminal and a second terminal disposed between the chip package and the package substrate; a first solder connecting the first terminal with the first dummy pad and the chip package; and a second solder connecting the second terminal with the second dummy pad and the chip package. |
申请公布号 |
US2016329262(A1) |
申请公布日期 |
2016.11.10 |
申请号 |
US201615064545 |
申请日期 |
2016.03.08 |
申请人 |
MEDIATEK INC. |
发明人 |
Hsiao Ching-Wen;Lin Tzu-Hung;Peng I-Hsuan;Hsieh Tung-Hsien;Chang Sheng-Ming |
分类号 |
H01L23/367;H01L23/498;H01L25/16;H01L25/065;H01L23/00;H01L23/31 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor chip package assembly, comprising:
a substrate having a chip mounting surface; a plurality of solder pads disposed on the chip mounting surface; a first dummy pad and a second dummy pad spaced apart from the first dummy pad disposed on the chip mounting surface; a solder mask on the chip mounting surface and partially covering the solder pads, the first dummy pad, and the second dummy pad; a chip package mounted on the chip mounting surface and electrically connected to the substrate through a plurality of solder balls on respective said solder pads; a discrete device having a first terminal and a second terminal disposed between the chip package and the substrate; a first solder connecting the first terminal with the first dummy pad and the chip package; and a second solder connecting the second terminal with the second dummy pad and the chip package. |
地址 |
Hsin-Chu TW |