| 发明名称 |
Antenna Apparatus and Method |
| 摘要 |
An antenna apparatus comprises a semiconductor die embedded in and adjacent to a first side of a molding compound layer, a plurality of first interconnects formed on the first side of the molding compound layer, wherein the plurality of first interconnects are electrically connected the semiconductor die and an antenna structure formed on a second side of the molding compound layer, wherein the antenna structure is electrically connected to the semiconductor die through a via connected between the plurality of first interconnects and the antenna structure. |
| 申请公布号 |
US2016359221(A1) |
申请公布日期 |
2016.12.08 |
| 申请号 |
US201615237904 |
申请日期 |
2016.08.16 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chih Lai Wei;Liu Monsen;Yeh En-Hsiang;Wang Chuei-Tang;Yu Chen-Hua |
| 分类号 |
H01Q1/22;H01L23/522;H01L21/56;H01Q9/04;H01L23/48;H01L23/498;H01L23/00;H01Q1/36;H01L23/66;H01L21/48 |
主分类号 |
H01Q1/22 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A device comprising:
a semiconductor die embedded in and adjacent to a first side of a molding compound layer; a plurality of first interconnects formed on the first side of the molding compound layer, wherein the plurality of first interconnects are electrically connected the semiconductor die; and an antenna structure formed on a second side of the molding compound layer, wherein:
the antenna structure is electrically connected to the semiconductor die through a via connected between the plurality of first interconnects and the antenna structure. |
| 地址 |
Hsin-Chu TW |
