发明名称 Semiconductor device with structural stability
摘要 The present disclosure provides a semiconductor device with a structural stability. The semiconductor device includes a stack of vertical alterations of conductive layers and insulating layers; supports passing through the stack, each of the supports having a cross-section of an equilateral polygon, the supports being equidistantly arranged in a first direction and a second direction, the first and second directions crossing each other; and contact plugs electrically coupled respectively to the conductive layers, each of the contact plugs being disposed between at least two adjacent supports of the supports.
申请公布号 US9530742(B1) 申请公布日期 2016.12.27
申请号 US201615050984 申请日期 2016.02.23
申请人 SK Hynix Inc. 发明人 Jung Sung Wook;Kim Kyung Bo;Baek Ji Hui;Jung Jang Hee
分类号 H01L23/48;H01L23/52;H01L29/40;H01L23/00;H01L23/528;H01L23/522;H01L27/115;H01L27/06 主分类号 H01L23/48
代理机构 IP & T Group LLP 代理人 IP & T Group LLP
主权项 1. A semiconductor device comprising: a stack including alternately stacked conductive layers and insulating layers; supports passing through the stack, each of the supports having a cross-section of an equilateral polygon or a circular shape, the supports being equidistantly arranged in a first direction and a second direction, the first and second directions crossing each other; and contact plugs coupled respectively to the conductive layers, each of the contact plugs being disposed between at least two adjacent supports of the supports.
地址 Gyeonggi-do KR