发明名称 |
Semiconductor device with structural stability |
摘要 |
The present disclosure provides a semiconductor device with a structural stability. The semiconductor device includes a stack of vertical alterations of conductive layers and insulating layers; supports passing through the stack, each of the supports having a cross-section of an equilateral polygon, the supports being equidistantly arranged in a first direction and a second direction, the first and second directions crossing each other; and contact plugs electrically coupled respectively to the conductive layers, each of the contact plugs being disposed between at least two adjacent supports of the supports. |
申请公布号 |
US9530742(B1) |
申请公布日期 |
2016.12.27 |
申请号 |
US201615050984 |
申请日期 |
2016.02.23 |
申请人 |
SK Hynix Inc. |
发明人 |
Jung Sung Wook;Kim Kyung Bo;Baek Ji Hui;Jung Jang Hee |
分类号 |
H01L23/48;H01L23/52;H01L29/40;H01L23/00;H01L23/528;H01L23/522;H01L27/115;H01L27/06 |
主分类号 |
H01L23/48 |
代理机构 |
IP & T Group LLP |
代理人 |
IP & T Group LLP |
主权项 |
1. A semiconductor device comprising:
a stack including alternately stacked conductive layers and insulating layers; supports passing through the stack, each of the supports having a cross-section of an equilateral polygon or a circular shape, the supports being equidistantly arranged in a first direction and a second direction, the first and second directions crossing each other; and contact plugs coupled respectively to the conductive layers, each of the contact plugs being disposed between at least two adjacent supports of the supports. |
地址 |
Gyeonggi-do KR |