MULTI DEPTH SUBSTRATE FABRICATION PROCESSES

摘要

Method of fabricating microstructures on a substrate. The method comprises providing a substrate layer (100) having a first surface with a resist layer (102). First selected regions of the resist layer are exposed to an environment (104) that renders the resist layer more or less soluble in a developer solution. The resist layer is then developed to expose selected regions of the substrate surface (106a). Second selected regions (110) of th e resist layer are then exposed to an environment (108) that renders the resis t layer more or less soluble in the developer solution by aligning exposure of the second selected regions to the first selected regions. The first selecte d regions of the substrate surface are etched (106b). Second selected regions of the resist layer are then developed to expose the second selected regions of the substrate surface (110a). The substrate layer is then etched and the resist removed to form a multi-depth substrate.