| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, which is excellent in filling properties and can give a semiconductor device with little occurrence of flash, excellent in soldering crack resistance. SOLUTION: The epoxy resin composition comprises essentially (A) an epoxy resin containing a crystalline epoxy resin with a melting point of 70-150 deg.C in an amount of 30 wt.% or more based on the total epoxy resin, (B) a phenol resin, (C) a fused silica powder, (D) glass spheres and (E) a cure accelerator, wherein the fused silica powder (C) accounts for 45-70 wt.% of the total resin composition, contains 70 wt.% or more spherical silica powder and has a mean particle diameter of 10-25μm and a specific surface of 2.5-7.5 m<2> /g, and wherein the glass spheres (D) account for 15-45 wt.% of the total resin composition and have a mean particle diameter of 47-57μm. The composition is used for sealing a semiconductor element to give a semiconductor device.
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