发明名称 |
METHOD TO PRESERVE ALIGNMENT MARK OPTICAL INTEGRITY |
摘要 |
A method for protecting an alignment mark area during a CMP process including forming at least a first material layer over a process surface of a semiconductor wafer including active areas and alignment mark trenches formed in the at least one alignment mark area; forming at least a second material layer over the first material layer including the active areas and the at least one alignment mark area; lithographically patterning and etching the at least a second material layer to form at least a plurality lines of the at least a second material layer adjacent to the alignment mark trenches; and, carrying out a CMP process to remove at least a portion of the at least a second material layer.
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申请公布号 |
US2004185637(A1) |
申请公布日期 |
2004.09.23 |
申请号 |
US20030394089 |
申请日期 |
2003.03.20 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., |
发明人 |
FU SHIH-CHI;SHIU FENG-JIA;HO CHIA-TUNG;WU CHIH-TA;KUO CHING-SEN;CHEN JIEH-JANG;SHIAU GWO-YUH;TSIA CHIA-SHIUNG |
分类号 |
H01L21/762;H01L23/544;(IPC1-7):H01L21/76 |
主分类号 |
H01L21/762 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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