| 摘要 |
A semiconductor device comprising a support plate (5) having a heat dispersion characteristic; and first and second semiconductor elements (1,2) sequentially deposited and fixed over the support plate (5) and caused to perform alternate switching operations. Sequentially depositing and fixing the first and second semiconductor elements (1,2) over the support plate (5) can reduce the footprint on the support plate (5) and improve the integration degree. Causing the first and second semiconductor elements (1,2) to perform alternate switching operations can reduce the heating values of the first and second semiconductor elements (1,2). Thus, a plurality of semiconductor elements of a semiconductor device can be deposited on a small area and the semiconductor device can be caused to operate with a desirable heat dispersion characteristic. |
