| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flexible circuit board capable of being applied to a COF package easily coping with a fine pitch tendency of a wiring layer, and provided with the wiring layer with high reliability. <P>SOLUTION: The wiring layer 12 including an inner lead 12a and an outer lead 12b on a flexible circuit board 10, an inner lead reinforcing electrode 16a connected to a semiconductor chip 30 is formed on the inner lead 12a, an outer lead reinforcing electrode 16c is formed on the outer lead, and a wire reinforcing section 16b is formed on the wiring layer 12 between the inner lead 12a and the outer lead 12b. The flexible board is mounted on an electronic apparatus by folding part of the flexible board to which the wiring reinforcing section 16b is provided between the inner lead 12a and the outer lead 12b. <P>COPYRIGHT: (C)2007,JPO&INPIT |
