发明名称 SEMICONDUCTOR LIGHT EMITTING ELEMENT, AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a high-luminance semiconductor light emitting element by forming a metal reflecting layer by using an opaque semiconductor substrate; and its manufacturing method. <P>SOLUTION: This semiconductor light emitting element is composed of: a GaAs substrate structure having a GaAs layer 3, a first metal buffer layer 2 arranged on a surface of the GaAs layer, a first metal layer 1 arranged on the first metal buffer layer, and a second metal buffer layer 4 and a second metal layer 5 arranged on the back surface of the GaAs layer; and a light emitting diode structure arranged on the GaAs substrate structure, and having a third metal layer 12, a metal contact layer 11 arranged on the third metal layer, a p-type clad layer 10 arranged on the metal contact layer, a multiple quantum well layer 9 arranged on the p-type clad layer, an n-type clad layer 8 arranged on the multiply quantum well layer, and a window layer 7 arranged on the n-type clad layer; and is characterized by sticking the GaAs substrate structure on the light emitting diode structure by using the first metal layer 1 and the third metal layer 12. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008311352(A) 申请公布日期 2008.12.25
申请号 JP20070156381 申请日期 2007.06.13
申请人 ROHM CO LTD 发明人 TAKAO SHOWA;SAKAI MITSUHIKO;NAKADA SHUNJI
分类号 H01L33/06;H01L33/10;H01L33/12;H01L33/14;H01L33/30;H01L33/36 主分类号 H01L33/06
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