Lighting apparatus having improved light output uniformity and thermal dissipation

摘要

The present disclosure involves a lighting apparatus. The lighting apparatus includes a photonic device that generates light. The lighting apparatus includes a printed circuit board (PCB) on which the photonic device is located. The lighting apparatus includes a diffuser cap having a curved profile covering the PCB and the photonic device. The diffuser cap has a textured surface for scattering light generated by the photonic device. The lighting apparatus includes a thermally conductive cup that surrounds the diffuser cap and thermal conductively coupled to the PCB. The cup has a reflective inner surface that reflects light transmitting through the diffuser cap. The lighting apparatus includes a heat dissipation structure for dissipating heat generated by the photonic device. The heat dissipation structure is thermally coupled to the cup.

主权项

1. A lighting instrument, comprising:
a substrate; a heat sink thermal-conductively coupled to the substrate; one or more light-emitting devices disposed over the substrate; a diffuser cap disposed over the substrate, wherein the diffuser cap houses the one or more light-emitting devices therein, wherein the diffuser cap has a textured surface; and a reflective structure disposed over the substrate and thermal-conductively coupled to the heat sink, wherein the reflective structure circumferentially surrounds the one or more light-emitting devices.