发明名称 COIL ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF SAME
摘要 PROBLEM TO BE SOLVED: To provide a coil electronic component capable of improving a chipping failure and a manufacturing method of the same.SOLUTION: A coil electronic component includes: a coil part 40; an insulation film 30, covering the coil part 40; a magnetic body 50, surrounding the coil part 40, covered by the insulation film 30; and an adhesive layer 60, formed between the insulation film 30 and the magnetic body 50, preventing chipping of the magnetic body 50. The adhesive layer 60 has adhesive strength larger than that of the magnetic body 50. The magnetic body 50 contains a metal magnetic powder and a thermosetting resin.SELECTED DRAWING: Figure 2
申请公布号 JP2016167578(A) 申请公布日期 2016.09.15
申请号 JP20160007494 申请日期 2016.01.18
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 KIM YU NA;PARK MOON SOO;KIM MIN HEE;LEE JONG HO
分类号 H01F17/00;H01F17/04;H01F27/06;H01F27/24;H01F41/04 主分类号 H01F17/00
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