SURFACE TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, MANUFACTURING METHOD OF SUBSTRATE, MANUFACTURING METHOD OF PRINTED WIRING BOARD, MANUFACTURING METHOD OF PRINTED CIRCUIT SHEET AND MANUFACTURING METHOD OF COPPER LAMINATE

摘要

PROBLEM TO BE SOLVED: To provide a surface treated copper foil capable of providing a profile shape of a substrate surface after removing the copper foil maintaining fine wiring formability and achieving good adhesiveness of a non electrolytic copper plating film.SOLUTION: There is provided a surface treated copper foil having a surface treated layer formed on a copper foil, having a ratio of the three dimensional surface area B and two dimensional surface area A of a surface treated surface, B/A, of 1.05 to 1.8, and the ratio of the three dimensional surface area B and two dimensional surface area A of a copper foil removal side surface of a resin material, B/A, of 1.01 to 1.5 when laminating the surface treated copper foil with the resin substrate for printed wiring sheet from the surface treated layer side and removing the surface treated copper foil.SELECTED DRAWING: Figure 3