| 摘要 |
PROBLEM TO BE SOLVED: To provide a back grind tape which can grind/polish a semiconductor wafer surface uniformly, by absorbing level difference due to grooves or holes in the vacuum chuck table of a grinder at the time of grinding or polishing, in the grinding process of an extremely thin semiconductor wafer of 30 μm or less.SOLUTION: In a back grind tape, an adsorption layer composed of silicon resin is provided on one side of a substrate film, and a level difference absorption layer composed of a block copolymer of methyl methacrylate (MMA) and butyl acrylate (BA) is provided on the opposite side. |
