| 摘要 |
A lead-free, silver-free solder alloy includes 0.001 to 0.800% by weight copper, 0.080 to 0.120% by weight bis muth, 0.030 to 0.050% by weight nickel, 0.008 to 0.012% by weight phosphorus, and balance tin, together with unavoidable impurities. The solder alloy can be in the form of one of a bar, a stick, a solid or flux cored wire, a foil or strip, or a powder or paste, or solder spheres for use in ball grid arrays or chip scale packages, or other pre-formed solder pieces. The solder alloy can be used to create a solder joint between an electronic component and a pad of an electronic substrate. |
