| 发明名称 |
System and Method for a Packaged MEMS Device |
| 摘要 |
According to an embodiment, a device includes a substrate, a transducer die disposed over the substrate, a cover disposed over the transducer die, and a support structure connecting the cover to the substrate. The support structure includes a port configured to allow transfer of fluidic signals between an ambient environment and the transducer die. |
| 申请公布号 |
US2016305837(A1) |
申请公布日期 |
2016.10.20 |
| 申请号 |
US201514687276 |
申请日期 |
2015.04.15 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Froemel Andreas |
| 分类号 |
G01L9/00;B81C1/00;B81B7/00 |
主分类号 |
G01L9/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A device comprising:
a substrate; a transducer die disposed over the substrate; a cover disposed over the transducer die; and a support structure connecting the cover to the substrate, wherein the support structure comprises a port configured to allow transfer of fluidic signals between an ambient environment and the transducer die. |
| 地址 |
Neubiberg DE |
