NON-CONTACT TEMPERATURE SENSOR

摘要

A non-contact temperature sensor is provided, the sensor including: an insulating film, a thin film thermistor portion formed on a front-surface of the insulating film, a pair of comb shaped electrodes formed on the thin film thermistor portion, a pair of pad electrodes formed on the front-surface of the insulating film, a pair of pattern wiring portions, and a pair of lead frames that is adhered to the pair of pad electrodes on the front-surface side of the insulating film, wherein the thin film thermistor portion is formed in a thermistor forming region arranged on the front-end side of the insulating film, the pad electrodes are formed in an electrode forming region arranged on the base-end side of the insulating film, the front-end side of the pair of lead frames is arranged to surround the circumference of the thermistor forming region in a non-contact manner.

主权项

1. A non-contact temperature sensor comprising:
an insulating film; a thin film thermistor portion made of a thermistor material that is patterned on a front-surface of the insulating film; a pair of comb shaped electrodes that is patterned so as to be opposed to each other and to have a plurality of comb portions at least either on the upper or lower surface of the thin film thermistor portion; a pair of pad electrodes that is patterned on the front-surface of the insulating film; a pair of pattern wiring portions that is patterned on the front-surface of the insulating film with one end thereof being connected to the pair of comb shaped electrodes and the other end thereof being connected to the pair of pad electrodes; and a pair of lead frames that is adhered to the pair of pad electrodes on the front-surface side of the insulating film, wherein the thin film thermistor portion is formed in a thermistor forming region arranged on the front-end side of the insulating film, the pad electrodes are formed in an electrode forming region arranged on the base-end side of the insulating film, and the front-end side of the pair of lead frames is arranged so as to surround the circumference of the thermistor forming region in a non-contact manner.