| 摘要 |
The present invention provides adhesive film removal methods and apparatus. The removal methods and apparatus involve apply tension over the width of the adhesive film, thereby removing the film from the substrate along the release line that extends over the width of the film. The methods and apparatus are particularly useful in removing large-scale graphic films from substrates such as truck trailers, vans, walls, signs and other large surfaces. The tension applied to the adhesive film during removal is preferably uniform across the width of the film, thereby reducing the risk of the film tearing or breaking during removal. The release line is advanced during removal along the length of the film until the entire film is removed from the substrate.
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