发明名称 |
EPITAXIAL WAFER, MANUFACTURING METHOD THEREOF AND ULTRAVIOLET LIGHT EMITTING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide an epitaxial wafer, manufacturing method thereof and an ultraviolet light emitting device capable of increasing the flatness and the crystallinity on the surface of a single crystal aluminum nitride layer formed over a silicon substrate.SOLUTION: An epitaxial wafer 1 includes: a silicon substrate 11; a single crystal aluminum nitride layer 16 formed over one surface of the silicon substrate 11; and an aluminum deposit 12 formed between the silicon substrate 11 and the aluminum nitride layer 16 to prevent formation of a silicon nitride. The epitaxial wafer 1 includes plural cavity parts 17 formed across the silicon substrate 11, the aluminum deposit 12 and the aluminum nitride layer 16. The aluminum deposit 12 and the aluminum nitride layer 16 are formed in a pressure reduction MOVPE apparatus. The epitaxial wafer 1 is used for manufacturing of ultraviolet light emitting devices. |
申请公布号 |
JP2014053412(A) |
申请公布日期 |
2014.03.20 |
申请号 |
JP20120196105 |
申请日期 |
2012.09.06 |
申请人 |
PANASONIC CORP;INSTITUTE OF PHYSICAL & CHEMICAL RESEARCH;UNIV OF TOKYO |
发明人 |
MINO TAKUYA;TAKANO TAKAYOSHI;TSUBAKI KENJI;HIRAYAMA HIDEKI;SUGIYAMA MASAKAZU |
分类号 |
H01L21/205;C23C16/12;C23C16/34;H01L33/32 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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