Soldering method and apparatus

摘要

A soldering apparatus includes an inspection station I downstream of the soldering station D. A board PCB2 is collected from conveyor A, soldered at station D and returned to conveyor A, while a previously soldered board PCB2 is inspected at station I. If PCB1 board fails inspection at station I, PCB2 is moved from conveyor A to conveyor B, so that PCB1 can be moved back on to conveyor A, for collection and re-soldering at station D. PCB2 can then be moved forwards for inspection at station I.