INSULATION COMPOSITION FOR MULTILAYERED PRINTED CIRCUIT BOARD, METHOD FOR PREPARING THEREOF, AND MULTILAYERED PRINTED CIRCUIT BOARD COMPRISING INSULATION LAYER THEREOF

摘要

The present invention relates to an insulation composition for a multilayered printed circuit board comprising 0.5-10 wt% of nanoclay, 5-50 wt% of soluble liquid crystal oligomer, 5-50 wt% of epoxy resin, 5-40 wt% of solvents and 50-80 wt% of inorganic fillers, a prepreg and an insulating film using the composition, and a multilayered printed circuit board comprising the prepreg and insulation film as an interlayer insulation layer. According to the embodiment of the present invention, the composition manufactured by mixing nanoclay with soluble liquid crystal oligomer (LCD) with excellent thermal, electrical and mechanical properties, epoxy resins and inorganic fillers is able to be applied to a substrate insulation material such as prepreg, film and the like capable of implementing low thermal expansion coefficient, high hardness, and high thermal properties.