| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a double-sided polishing method of a semiconductor wafer for improving the degree of planarity of polished surfaces of front and rear sides and preventing sticking when carrying out the double-sided polishing of the semiconductor wafer using a double-sided polishing machine. <P>SOLUTION: There is provided the double-sided polishing method of a semiconductor wafer for simultaneously polishing the front and rear sides of the semiconductor wafer using a double-sided polishing machine including a carrier for accommodating a plurality of semiconductor wafers, an upper surface plate and a lower surface plate between which the carrier is sandwiched, and a polishing pad prepared on each of the upper surface plate and the lower surface plate. The polishing pad 22 on an upper surface plate side is one having a pattern in which a plurality of grooves extending radially from the center of rotation of the polishing pad are formed. The polishing pad on a lower surface plate side is one having a pattern different from that of the polishing pad on the upper surface plate side. Double-sided polishing is carried out by use of these pads. <P>COPYRIGHT: (C)2009,JPO&INPIT |
