| 发明名称 | Heat sink with an integrated vapor chamber | ||
| 摘要 | A cooling subsystem is provided for dissipating heat from processor. The cooling subsystem includes a heat sink comprising an upper portion having a plurality of fins formed therein and a base portion fixed to the upper portion to form a vapor chamber in an enclosed volume between the upper portion and the base portion. | ||
| 申请公布号 | US9436235(B2) | 申请公布日期 | 2016.09.06 |
| 申请号 | US201313778053 | 申请日期 | 2013.02.26 |
| 申请人 | NVIDIA Corporation | 发明人 | Damaraju Srinivasa Rao;Walters Joseph;O'Connor Dalton Seth |
| 分类号 | G06F1/16;H05K5/00;H05K7/00;G06F1/20;H01L23/427 | 主分类号 | G06F1/16 |
| 代理机构 | Zilka-Kotab, PC | 代理人 | Zilka-Kotab, PC |
| 主权项 | 1. A heat sink comprising: an upper portion having a plurality of fins formed therein; and a base portion fixed to the upper portion to form a vapor chamber in an enclosed volume between the upper portion and the base portion, wherein the vapor chamber comprises an interior volume of at least one of the fins in the plurality of fins, wherein a bottom surface of the base portion contacts a processor such that heat generated by the processor is transferred through the base portion to a pool of liquid contained within the vapor chamber. | ||
| 地址 | Santa Clara CA US | ||