发明名称 |
Conductor board and method for producing a conductor board |
摘要 |
The conductor board has at least one layer of a dielectric provided areally on two mutually opposed faces with at least one metalization on each. There is at least one through contacting in the region of an aperture. The metalizations are applied to cover at least one aperture and are electrically connected to each other through the aperture.
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申请公布号 |
US2004181940(A1) |
申请公布日期 |
2004.09.23 |
申请号 |
US20030750617 |
申请日期 |
2003.12.31 |
申请人 |
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发明人 |
SCHULZ-HARDER JURGEN;MEYER ANDREAS |
分类号 |
H05K1/03;H05K3/40;(IPC1-7):H05K3/34;H01R43/00;H05K3/00;H01R43/04 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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