| 摘要 |
A method of testing a semiconductor device includes the steps of: positioning on a surface of a test jig a semiconductor wafer provided with the semiconductor device; dividing the semiconductor wafer into a plurality of semiconductor chips on the surface by dicing the semiconductor wafer; and, with the plurality of semiconductor chips positioned on the surface, testing an electrical characteristic of semiconductor device. Consequently, a method of testing a semiconductor device which can test an electrical characteristic with higher accuracy prior to an assembling step, can be provided.
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