| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce a stress applied to an electronic component in pressurizing. <P>SOLUTION: A plurality of spacer layers 20 are stacked on a lowest layer 30, electronic components 40 are disposed in component mounting holes 20a formed by through-holes 22 of the spacer layers 20, and an uppermost layer 50 is stacked thereon. In a pressing process, the lowest layer 30, the spacer layers 20, and the uppermost layer 50 are pressed while being heated from both sides in the stacked direction into a curved surface, using metal molds 90a, 90b having curved pressing surface, with the electronic components 40 supported in the component mounting holes 20a, and gaps 60 for releasing stress to the electronic components due to the pressurization disposed around the electronic components 40. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
