| 摘要 |
The control device (1) has a housing (3), which is made of an insulating resin and includes opening areas. A heat sink (5) is fastened to an end of the housing, and a power device i.e. semiconductor control element (2), is fastened to the heat sink. A circuit board (4) is arranged opposite to the heat sink. The heat sink is formed from a heat sink main body and an isolating film, which is formed at a surface of the main body at a side. The main body has outer circumference end surfaces, which are arranged opposite to inner wall surfaces (3d) of one of the opening areas of the housing. |
