| 摘要 |
The present invention relates to a CMP device provided with a polishing pad surface property measuring device which measures the surface properties of a polishing pad used to polish a substrate. This CMP device is provided with: a polishing pad surface property measuring device (30) which radiates laser light onto the surface of a polishing pad (2), receives light reflected from the polishing pad, and obtains a reflection intensity for each angle of reflection; an arithmetic logic unit (40) which obtains a spatial wavelength spectrum of the polishing pad surface by subjecting the reflection intensity distribution obtained by the measuring device to a Fourier transformation, and obtains the polishing pad surface properties by numerical analysis; a dressing control unit (23) which, on the basis of the polishing pad surface properties obtained by the arithmetic logic unit, uses closed-loop control to determine dressing conditions for the polishing pad (2); and a dressing device (20) which dresses the polishing pad on the basis of the dressing conditions determined by the dressing control unit. |
