| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that a reaction resin, in particular, a reaction resin containing no filler occasionally has a high coefficient of thermal expansion, for instance, approximately 140 ppm/K when having exceeded a glass transition temperature (Tg) for the application in which the glass transition temperature is exceeded, and the coefficient of thermal expansion is occasionally clearly higher than a coefficient of thermal expansion at a temperature lower than the glass transition temperature, for instance, approximately 65 ppm/K, which may cause a problem.SOLUTION: A reaction resin contains at least one conductive filler, and at least one cyanate ester and/or at least one alicyclic epoxy resin.SELECTED DRAWING: None |
