发明名称 PROCESSING METHOD OF LAMINATED SUBSTRATE, AND PROCESSING DEVICE OF LAMINATED SUBSTRATE BY LASER BEAM
摘要 PROBLEM TO BE SOLVED: To process a brittle material substrate and a resin layer constituting a laminated substrate, simultaneously in a high quality.SOLUTION: A processing method includes a first step and a second step. In the first step, a laminated substrate G comprising a glass substrate 11, and a resin layer 12 formed on the surface of the glass substrate 11 is prepared. In the second step, a laser beam having a prescribed wavelength is condensed onto the glass substrate 11 to irradiate the laminated substrate G, and thereby a laser beam irradiation part of the resin layer 12 is modified, to thereby lower brittle fracture strength more than that of its periphery, and simultaneously generates a crack on the glass substrate 11.SELECTED DRAWING: Figure 2
申请公布号 JP2016166120(A) 申请公布日期 2016.09.15
申请号 JP20150255698 申请日期 2015.12.28
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 KOKUSHO TOMOJI;IKEDA TSUYOSHI;YAMAMOTO KOJI;NAKATANI FUMIYOSHI
分类号 C03B33/09;B23K26/00;B23K26/53;B23K26/57 主分类号 C03B33/09
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