2D MATRIX ARRAY BACKING INTERCONNECT ASSEMBLY, 2D ULTRASONIC TRANSDUCER ARRAY, AND METHOD OF MANUFACTURE

摘要

Disclosed is a 2D Matrix Array Backing Interconnect Assembly that provides a structure that enables simple construction of complex wring for an ultrasonic transducer array of desired dimension. A backing interconnect assembly can be produced by forming a plurality of high density interconnect printed circuit boards, with layers each having a respective array of metal traces, wherein the metal traces are internally connected one-to-one to electrically conductive pads. An end of the metal traces are exposed at a surface to form respective conductive elements. High density interconnect printed circuit boards can be attached to a flexible printed circuit having contact pads that correspond to conductive pads of the printed circuit boards to form interconnect modules. The interconnect modules can be attached to form a backing interconnect assembly. The backing interconnect assembly with exposed conductive elements provides complex wiring interconnect for manufacture of small sized 2D ultrasonic transducer arrays.

主权项

1. A method of producing a two dimensional matrix array backing interconnect assembly, characterized by:
forming a plurality of high density interconnect printed circuit boards, each high density interconnect printed circuit board having a plurality of alternating layers of a dielectric layer and a lamination material, each dielectric layer having an array of metal traces, wherein a two dimensional matrix of electrically conductive pads is formed on an outermost surface of the high density interconnect printed circuit board that is parallel to an array of the metal traces, wherein the metal traces are internally connected one-to-one to each of the electrically conductive pads by way of electrically conductive through-holes, wherein an end of the metal traces are exposed at a surface of the alternating layers to form respective conductive elements; forming a plurality of flexible printed circuits, each flexible printed circuit having at least one two dimensional array of electrically conductive pads, wherein one of the two dimensional matrix of pads corresponds one-to-one to the two dimensional matrix of electrically conductive pads is formed on the outermost surface of one of the high density interconnect printed circuit boards, each flexible printed circuit having at least one secondary two dimensional array of electrically conductive pads in a section of the flexible printed circuit that is separate from a section having the at least one two dimensional array of electrically conductive pads; attaching one said flexible printed circuit to a first one said high density interconnect printed circuit board so that the corresponding two dimensional matrix of pads line up one-to-one; repeating said attaching of one flexible printed circuit to one said high density interconnect printed circuit board for each of the plurality of flexible printed circuits and each of the plurality of said high density interconnect printed circuit boards to form interconnect modules; and attaching the interconnect modules to form a two dimensional matrix array backing interconnect assembly.