Wafer Level Packaging Cap and Fabrication Method Thereof

摘要

A fabrication method of a wafer level packaging cap (3) for covering a device wafer (4) provided with a device (50) thereon, includes forming an insulating layer (22) on a wafer (20); removing a predetermined part of the insulating layer and exposing an upper surface of the wafer; forming a cap pad (24) extending from an upper surface and the exposed surface of the wafer; forming a cavity (20a) on a lower surface of the wafer corresponding to the cap pad; etching a bottom surface of the cavity and exposing the cap pad which is connected to the wafer through the cavity; and forming metal lines (26) extending from the lower surface of the wafer and the cavity, to electrically connect the cap pad which is exposed through the cavity.