发明名称 |
Mold compound cap in a flip chip multi-matrix array package and process of making same |
摘要 |
A molding compound cap structure is disclosed. A process of forming the molding compound cap structure is also disclosed. A microelectronic package is also disclosed that uses the molding compound cap structure. A method of assembling a microelectronic package is also disclosed. A computing system is also disclosed that includes the molding compound cap structure. The molding compound cap includes a configuration that exposes a portion of a microelectronic device.
|
申请公布号 |
US2008032459(A1) |
申请公布日期 |
2008.02.07 |
申请号 |
US20070906594 |
申请日期 |
2007.10.02 |
申请人 |
LEBONHEUR VASSOUDEVANE;HARRIES RICHARD J |
发明人 |
LEBONHEUR VASSOUDEVANE;HARRIES RICHARD J. |
分类号 |
H01L21/56;H01L23/31 |
主分类号 |
H01L21/56 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|