| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for power module which can suppress the infiltrating of a brazing material. SOLUTION: A ceramics substrate 11 is provided with rough-surface sections 14a and 15a that are formed outside and inside including the outer edge of the respective arrangement areas of a metal layer 12 or a circuit layer 13 along their outer edges; and smooth sections 14b and 15b that are surrounded by the rough-surface sections 14a and 15a in the arrangement areas and are smoother than the rough-surface sections 14a and 15a. In this case, the arithmetic average roughness of the rough-surface sections 14a and 15a is 0.4μm or more. COPYRIGHT: (C)2009,JPO&INPIT |
