发明名称 |
FLEXIBLE CARRIER FOR HIGH VOLUME ELECTRONIC PACKAGE FABRICATION |
摘要 |
An assembly for producing partially packaged semiconductor devices is provided. In one embodiment, the assembly includes a magnetic plate; a flexible substrate disposed adjacent the magnetic plate and having two surfaces; a nonstick coating disposed on one surface of the flexible substrate thereby exposing a nonstick surface; and a tape layer having two surfaces. The tape layer is adhesively attached to the nonstick surface to expose a surface of the tape layer. A frame is disposed on the exposed surface of the tape layer, and a plurality of integrated circuit (IC) die is positioned within the frame and supported by the tape layer. A panel is formed within the frame that at least partially surrounds the plurality of IC die and that contacts the tape layer. |
申请公布号 |
US2009008802(A1) |
申请公布日期 |
2009.01.08 |
申请号 |
US20080212028 |
申请日期 |
2008.09.17 |
申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
LYTLE WILLIAM H.;AMRINE CRAIG S. |
分类号 |
H01L23/16 |
主分类号 |
H01L23/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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