ELECTROMAGNETIC BANDGAP STRUCTURE, PRINTED CIRCUIT BOARD COMPRISING THIS AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide an electromagnetic bandgap structure which doesn't make the total process longer because of dispensing with an inner layer drilling process, a plating process and filling process in the conventional manufacturing process of the printed circuit board although including the electromagnetic bandgap structure and can solve a mixed signal problem between an analog circuit and a digital circuit, and to provide a printed circuit board comprising this and a manufacturing method thereof.

SOLUTION: The electromagnetic bandgap structure includes: a first metal layer; a first dielectric layer stacked on the first metal layer; a metal plate stacked on the first dielectric layer; a second dielectric layer stacked on the metal plate and the first dielectric layer; a second metal layer stacked on the second dielectric layer; and a via directed from the metal plate to the first metal layer and the second metal layer. The via is connected to the first metal layer but is not connected to the second metal layer.

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