DEVICE MANUFACTURED BY ROOM-TEMPERATURE BONDING, DEVICE MANUFACTURING METHOD, AND ROOM-TEMPERATURE BONDING APPARATUS

摘要

An inter-substrate material layer is formed between a first substrate and a second substrate to generate a bonding strength. A plurality of metal elements are present in the inter-substrate material layer. An interface element existence ratio of the plurality of metal elements is 0.07 or above. A device can be obtained in which substrates difficult to bond (for example, SiO2 substrates) are bonded at room-temperature to have practical bonding strength.

主权项

1. A method of manufacturing a device, comprising:
performing sputtering on a surface of a first substrate; attaching one or more metal elements onto the surface of said first substrate; and bonding a second substrate to the surface of said first substrate at room temperature, wherein an interface element existence ratio of said one or more metal elements is 0.07 or above.