Substrate Material Favoring Via Hole Electroplating

摘要

The present invention proposes substrate material favoring via hole electroplating to overcome the conventional problem that the polymer-based printed circuit board is hard to conduct electricity and likely to have poor electroplating quality. The present invention adds a conductive material to a polymeric material and controls the proportions and structure thereof to form a substrate material so as to improve the affinity of the substrate material to the metal electroplated inside the via hole with the resistance of the substrate material remaining in an allowable range. Thereby is increased yield and efficiency and saved time and cost in fabricating printed circuit boards. Further, the present invention reduces the proportion of the polymeric material with the mechanical strength remaining in an allowable range so as to decrease the overall expansion rate and obtain a fire-proof effect. Therefore, the substrate material can be used to fabricate precision products.

主权项

1. A substrate material favoring via hole electroplating, comprising a polymeric material be used in an amount of 20-50 parts by weight parts by weight;
a filling material be used in an amount of 20-50 parts by weight; and a conductive material be used in an amount of 2-20 parts by weight and having a particle size of 0.1-10 μm.