发明名称 Monitoring dimensions of features at different locations in the processing of substrates
摘要 A substrate processing apparatus has a chamber having a substrate support (144), gas distributor (122), gas energizer (165), and gas exhaust port. A process monitor is provided to monitor features in a first region of the substrate and generate a corresponding first signal, and to monitor features in a second region of the substrate and generate a second signal. A chamber controller (300) receives and evaluates the first and second signals, and operates the chamber in relation to the signals. For example, the chamber controller can select a process recipe depending upon the signal values. The chamber controller can also set a process parameter at a first level in a first processing sector and at a second level in a second processing sector. The apparatus provides a closed control loop to independently monitor and control processing of features at different regions of the substrate.
申请公布号 EP1517357(A2) 申请公布日期 2005.03.23
申请号 EP20040019809 申请日期 2004.08.20
申请人 APPLIED MATERIALS, INC. 发明人 BARNES, MICHAEL;HOLLAND, JOHN;SHAN, HONGQING;PU, BRYAN Y.;JAIN, MOHIT;SUI, ZHIFENG;ARMACOST, MICHAEL D.;HANSON, NEIL E.;MA, DIANA XIAOBING;SINHA, ASHOK K.;MAYDAN, DAN
分类号 H01L21/02;H01L21/66;H01J37/32;H01L21/00;(IPC1-7):H01J37/32 主分类号 H01L21/02
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