| 摘要 |
A method and apparatus for reducing the installation height of an over-sized electrical component on a primary circuit board subject to maximum height restrictions. The invention exploits the allocated tolerance both above and below the printed circuit board. The electrical component is mounted to a daughter board, which is offset from and operatively connected to the primary circuit board. When assembled, the electrical component passes through an aperture in the primary circuit board. The offset mounting of the daughter board ensures that the component is positioned within the combined tolerance ranges as prescribed by the governing industry standards. An additional spacer between the primary and daughter boards provides additional installation height reduction.
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