| 摘要 |
A semiconductor device has a semiconductor substrate with an inclined through hole extending between its two major surfaces in a peripheral part of the substrate, providing an electrical interconnection between the two surfaces. The opening of the inclined through hole on the first major surface, on which electronic components are formed, is closer to the edge of the substrate than is the opening on the second major surface. Reliability is therefore enhanced because cracks forming at the edge of the second major surface are less likely to propagate to the through hole. An electrically conductive path in the through hole is formable by spraying conductive material onto its inner wall, using an ink-jet system.
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