| 摘要 |
An apparatus for joining a double-sided adhesive tape to a substrate includes: a chuck table for holding a substrate; a tape feed device for separating, from a double-sided adhesive tape having first and second separators, the first separator, and feeding the double-sided adhesive tape onto the chuck table; a joining roller for pressing the double-sided adhesive tape fed on the chuck table in the state that the first separator is separated, from a side of the second separator with rolling, and joining the double-sided adhesive tape to a surface of the substrate; a separator collecting device for separating the second separator wound and turned around by the joining roller from the double-sided adhesive tape in association with the forward movement for joining of the joining roller, and taking up the second separator in synchronization with the forward movement for joining of the joining roller; and a tape cutting mechanism including a cutter blade for cutting the double-sided adhesive tape joined to the substrate along with a contour of the substrate.
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