| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe device and a probe method that enable a probe to be brought into precise contact with each chip of a wafer.SOLUTION: A probe device which brings a plurality of chips formed by dicing into individual pieces a wafer stuck on a dicing sheet fixed to a frame and having ductility into contact with a plurality of probes of a tester at a time acquires measured positions of the respective chips on the wafer, and corrects relative probe positions of the probes to the wafer based upon an integrated position deviation quantity of the measured positions of the respective chips, thereby performing probing with the probes.SELECTED DRAWING: Figure 8B |
