METHOD FOR PRODUCING SUBSTRATE HAVING THROUGH HOLE FILLED WITH CONDUCTIVE MATERIAL

摘要

A method for producing a substrate having through holes filled with a conductive material wherein there is no air gap in the conductive material filled in the through holes. An underlying conductive layer is formed on one side of a core substrate provided with through holes, a conductive material is deposited and grown in the through holes from one side by electroplating using the underlying conductive layer as a feeding layer to fill the through holes with the conductive material such that an air gap is not formed, thereby producing a substrate having through holes filled with a conductive material.