Combination assembly of LED and liquid-vapor thermally dissipating device

摘要

A combination assembly of LED and liquid-vapor thermally dissipating device includes a liquid-vapor thermally dissipating device, a circuit board and at least one LED unit. The liquid-vapor thermally dissipating device includes a metal shell with liquid and capillarity structures therein. The circuit board is provided on the liquid-vapor thermally dissipating device. The LED unit includes a heat transmission base provided on the metal shell of the liquid-vapor thermally dissipating device, a LED chip provided on the heat transmission base, a package device encapsulating the LED chip and two transmitting plates having ends electrically connected to the LED chip and ends exposed out of the package device and electrically connected to the circuit board. The heat of the LED unit may be transmitted to the heat sink directly for heat transmission. The present invention provides a greater heat transmission efficiency.