摘要 |
The present invention provides an inductively coupled plasma treating apparatus capable of uniformly performing plasma treatment with respect to a large substrate to be treated by using a metallic window. The inductively coupled plasma treating apparatus, which performs inductively coupled plasma treatment with respect to a rectangular substrate, includes a treatment chamber to receive a substrate; a high-frequency antenna to generate inductively coupled plasma in a region in which the substrate is arranged in the treatment chamber; and a metallic window interposed between a plasma generation region, in which the inductively coupled plasma is generated, and the high-frequency antenna and having a rectangular shape corresponding to the substrate. A metallic window (20) is divided into a first region (201) including a long side (2a) and a second region (202) including a short side (2b) so that the first region (201) is insulated from the second region (202). In addition, the division is achieved in such a manner that the ratio (a/b) of a width (a) of the second region (202) formed radially to a width (B) of the first region (201) formed radially is in the range of 0.8 to 1.2. |