发明名称 FLUID EJECTION DEVICE
摘要 Disclosed is a method for fabricating a fluid ejection device. The method includes forming a drive circuitry layer on a substrate. The method further includes fabricating at least one fluid ejection element on the substrate. Furthermore, the method includes forming at least one slot within a top portion of the substrate, and forming at least one fluid feed trench within a bottom portion of the substrate. Each fluid feed trench of the at least one fluid feed trench is in fluid communication with one or more slots of the at least one slot. Additionally, the method includes laminating a flow feature layer and a nozzle plate over the substrate having the at least one slot and the at least one fluid feed trench formed therewithin. Further disclosed is a fluid ejection device fabricated using the aforementioned method.
申请公布号 US2016325546(A1) 申请公布日期 2016.11.10
申请号 US201615211981 申请日期 2016.07.15
申请人 FUNAI ELECTRIC CO., LTD. 发明人 BERNARD DAVID;MCNEES ANDREW;MRVOS JAMES
分类号 B41J2/14;B41J2/16;B41J2/045 主分类号 B41J2/14
代理机构 代理人
主权项
地址 Osaka JP
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