| 摘要 |
PROBLEM TO BE SOLVED: To provide communication between a transmitter and a receiver in one integrated circuit package.SOLUTION: An integrated circuit package comprises: a sealing portion 371; and a lead frame 300 having a part disposed inside the sealing portion 371. The lead frame 300 includes a first conductor. The first conductor is formed in the lead frame 300 and has a first conductive loop 310 and a third conductive loop 312 that are disposed substantially inside the insulating portion 371. A second conductor is formed in the lead frame 300 and is galvanic-insulated from the first conductor. The second conductor provides a communication link between the first conductor and the second conductor by including a second conductive loop 308 disposed adjacent to the first conductive loop 310 substantially inside the insulating portion 371. The third conductive loop 312 is reversely wound with respect to the first conductive loop 310 in the sealing portion 371. |
