发明名称 |
MEHRCHIPANLAGE UND SANDWICH-TYP VERFAHREN ZUR HERSTELLUNG DURCH VERWENDUNG VON LEITERN |
摘要 |
A device and method for increasing integrated circuit density comprising a pair of superimposed dies with a plurality of leads extending between the dies. The device is produced by providing a lower die which has a plurality of bond pads on a face side of the lower die. A layer of dielectric or insulative shielding is applied over the lower die face side. Leads are applied to an upper surface of the shielding layer. A plurality of lower die bond wires is attached between the lower die bond pads and an upper surface of their respective leads. A second layer of dielectric or insulative shielding is applied over the leads and the portion of the lower die bond wires extending over the lead upper surfaces. A back side of the upper die is adhered to an upper surface of the second shielding layer. A plurality of upper die bond wires are attached between a plurality of bond pads on a face side of the upper die and the upper surface of their respective leads. |
申请公布号 |
DE69621851(D1) |
申请公布日期 |
2002.07.18 |
申请号 |
DE1996621851 |
申请日期 |
1996.12.18 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
BALL, B. |
分类号 |
H01L25/18;H01L23/495;H01L23/50;H01L25/065;H01L25/07 |
主分类号 |
H01L25/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|